AMD adds two new Dual-Core processors

Aug. 11, 2009

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AMD said it has added two Dual-Core, 18W thermal design power (TDP) CPUs to its ASB-1 BGA embedded client platform.

Thermal design power represents the maximum amount of power the cooling system in a computer is required to dissipate.

The AMD Turion Neo X2 processor model L-625 and the AMD Athlon Neo X2 processor model L-325 are designed to provide PC performance in a low power envelope and with an embedded-friendly ball grid array (BGA) package.

The embedded client solution is suitable for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage.

AMD says that embedded system providers IBASE and IEI Technology Corp. should be among the first to introduce products based on the new CPUs.

Overall, the BGA package should reduce reliability problems for computer systems that are deployed in rugged environments and has a low z-height that is designed to enable thin, compact enclosures.

So far, all of AMD's embedded semiconductors are offered with industry-standard 5-year component longevity.

When combined with either the AMD 780-E or M-690-E chipset, embedded system designers can take advantage of a complete x86-based solution.

"With the AMD Athlon Neo X2 processor, AMD is now offering a new CPU option that improves on the power of the single core predecessor with just a small 3 watts of power consumption increase," said Dwight Looi, product manager, IBASE Technology.

"There is no 18 watt processor on the market that offers our customers precisely the same combination of power efficiency, performance and value, making it a natural choice for our embedded applications," added Looi.

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Source: AMD.

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